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Publications by Kai Matejat
Electrolytic Deposition of Fine Pitch Sn/Cu Solder Bumps for Flip Chip Packaging
International Symposium on Microelectronics
Related publications
Microstructure and Mechanical Properties of Sn–0.7Cu Flip Chip Solder Bumps Using Stencil Printing Method
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
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Under Bump Metallisation of Fine Pitch Flip-Chip Using Electroless Nickel Deposition
Journal of Electronics Manufacturing
Liquid Phase Bonding Using Au Compliant Bumps for Fine-Pitch Solder Bump Interconnection
Optoelectronic and Microwave Transmission Characteristics of Indium Solder Bumps for Low-Temperature Flip-Chip Applications
IEEE Transactions on Advanced Packaging
Fine Pitch and Low Temperature Bonding Using Solder Bumps and the Assessment of Solder Joint Reliability
Materials Transactions
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Condensed Matter Physics
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Solder Paste Reflow Modeling for Flip Chip Assembly
Growth Kinetics of Reaction Layers in Flip Chip Joints With Cu-Cored Lead-Free Solder Balls
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
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Microstructure of Interface Between Sn-Cu Solder With Ni and Cu Plate
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
The Characteristics of Electromigration and Thermomigration in Flip Chip Solder Joints
