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Publications by Kanae TOKIO
Sn Plating to Replace Sn-Pb Plating
Journal of The Surface Finishing Society of Japan
Related publications
Pb-Sn-Cu Alloy Plating From Fluoborate Baths by Pulse and Constant-Current Methods.
Journal of the Metal Finishing Society of Japan
Properties of Electroplated Sn-Ag Alloy Films as Pb-Free Solderable Coating Obtained by Composite Plating.
Journal of Japan Institute of Electronics Packaging
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Interface Structure of Cu Wire Bonding on Cu Substrate With Sn Plating
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Preparation and Characterization of Copper Powders With Sn Coating by the Electroless Plating
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Reactivity Between Sn–Ag Solder and Au/Ni–Co Plating to Form Intermetallic Phases
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Microstructure of Undercooled Pb–Sn Alloys
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Effect of Thin ENEPIG Plating Thickness on Interfacial Reaction and Brittle Fracture Rate of Sn-3.0Ag-0.5Cu Solder Joints
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Whisker-Like Formations in Sn-3.0Ag-Pb Alloys
Archives of Metallurgy and Materials
Chemical Plating
C&EN Global Enterprise
