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Publications by Kanako MATSUDA
Development of the Electrolytic Copper Plating Chemical and the Plating Equipment for Improvement of the Thickness Uniformity
Journal of The Surface Finishing Society of Japan
Related publications
Chemical Plating
C&EN Global Enterprise
Investigation of the Influence of Plating Additives on Lattice Defects in Electrolytic Copper Using Positron Annihilation Technique
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Formation of the Porous Film by Electroless Copper Plating.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Thickness Measuring Process of Nickel Plating on Copper or Its Alloy Using EDTA
Journal of the Metal Finishing Society of Japan
Chemical Etching and Plating Characteristics of Vapor Deposited Copper Film Using High Purity Copper Sources.
Journal of the Surface Finishing Society of Japan
Nondestructive Methods for the Acceptance of Plating Thickness on Printed Circuit Boards
The Influence of Ultrasonic Radiation on Chemical Ni-P Plating.
Journal of the Metal Finishing Society of Japan
Effect of Copper Strike Plating on Adhesion of Interface Between Silver and Nickel Plating After Thermal Treatment.
Journal of the Surface Finishing Society of Japan
Development of Ni-W Alloy Plating as a Substitution of Hard Chromium Plating
Transactions of the Materials Research Society of Japan
