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Publications by Keizo KISHIDA
Determination of a Constitutive Equation by the Thin Wafer Method
Transactions of the Japan Society of Mechanical Engineers
Impact. Measurement of Mixed-Mode Fracture Toughness for Brittle Materials Using Edge-Notched Half-Disk Specimen.
Zairyo/Journal of the Society of Materials Science, Japan
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Related publications
Accuracy in the Determination of Thin Films Optical Constants by the Atr Method
Le Journal de Physique Colloques
A New Integral Constitutive Equation and Determination of Material Constants for the Endochronic Theory of Cyclic Plasticity
Transactions of the Japan Society of Mechanical Engineers Series A
Dicing Process for Thin Silicon Wafer by Using Femtosecond-Laser
Journal of the Japan Society for Precision Engineering, Contributed Papers
A New Constitutive Equation on Ice Materials
Ships and Offshore Structures
Ocean Engineering
Mechanical Engineering
A Simplified Determination of Benzo(a)pyrene in Air-Born Particulates by Thin-Layer Densitometric Method
Journal of UOEH
Medicine
Environmental
Public Health
Occupational Health
Determination of the Metallic-Impurity Distribution on a Silicon Wafer by the Multiple Indicator-Rod Method for Liquid-Phase Dissolution and Graphite-Furnace AAS.
Bunseki Kagaku
Analytical Chemistry
Determination of Micelle Size by the Stokes-Einstein Equation
Chemical and Pharmaceutical Bulletin
Medicine
Drug Discovery
Chemistry
A Simple Elastic Constitutive Equation for Granular Material
Application of Boundary Integral Equation Method to Thin Layered Soil Model
Journal of Structural and Construction Engineering (Transactions of AIJ)
