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Publications by Kuan H. Lu

Thermal Stress Induced Delamination of Through Silicon Vias in 3-D Interconnects

English

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Temperature Properties of the Parasitic Resistance of Through-Silicon Vias (TSVs) in High-Frequency 3-D ICs

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Experimental Stress Characterization and Numerical Simulation for Copper Pumping Analysis of Through-Silicon Vias

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Synchrotron-Based Measurement of the Impact of Thermal Cycling on the Evolution of Stresses in Cu Through-Silicon Vias

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Postbond Test of Through-Silicon Vias With Resistive Open Defects

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Relaxation of Thermal Stress by Dislocation Motion in Passivated Metal Interconnects

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Integration of Electrografted Layers for the Metallization of Deep Through Silicon Vias

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Electromagnetic Analysis for Optical Coherence Tomography Based Through Silicon Vias Metrology

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On Finding a Simulation Model for Carbon Nanotubes as Through-Silicon-Vias

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Role of Delamination in Zeolite-Catalyzed Aromatic Alkylation: UCB-3 Versus 3-D Al-SSZ-70

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