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Thermal Stress Induced Delamination of Through Silicon Vias in 3-D Interconnects
doi 10.1109/ectc.2010.5490883
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Date
January 1, 2010
Authors
Kuan H. Lu
Suk-Kyu Ryu
Qiu Zhao
Xuefeng Zhang
Jay Im
Rui Huang
Paul S. Ho
Publisher
IEEE
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