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Publications by Kunihiro TSUBOSAKI
Influence of Surface Cleanness on Ultrasonic Ball Bondability of Au Wire Onto Au, Cu and Al Pads. Study of Ultrasonic Bonding With Surface Cleaning by Ion Bombardment(Report 2).
Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society
Mechanics of Materials
Surfaces
Alloys
Mechanical Engineering
Metals
Films
Coatings
Related publications
Ultrasonic Aluminum Wire Bonding. Final Report
Effect of Shielding Gases on Ball Forming and Bondability in Copper Wire Bonding
Journal of Smart Processing
The Influence of He+Ion Bombardment on Magnetic Properties of NiFe/Au/Co/Au Multilayers
Acta Physica Polonica A
Astronomy
Physics
Surface Damage Effects in Ultrasonic Cleaning of Silicon Wafers
Influence of Oxide Film on the Bondability of Aluminum in Ultrasonic Bonding and Materials Evaluation of Bonds
Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society
Mechanics of Materials
Surfaces
Alloys
Mechanical Engineering
Metals
Films
Coatings
Effect of Conduction Pre-Heating in Au-Al Thermosonic Wire Bonding
Journal of Surface Engineered Materials and Advanced Technology
Low-Temperature Direct Bonding of Flip-Chip Mountable VCSELs With Au-Au Surface Activation
IEEJ Transactions on Sensors and Micromachines
Electronic Engineering
Electrical
Mechanical Engineering
Effect of Primer Type and Ultrasonic Cleaning on Bonding to Zirconia Ceramic
Al-Azhar Dental Journal for Girls
GaAs Surface Wet Cleaning by a Novel Treatment in Revolving Ultrasonic Atomization Solution
Journal of Semiconductors
Electronic Engineering
Condensed Matter Physics
Materials Chemistry
Optical
Electrical
Magnetic Materials
Electronic
