Discover open access scientific publications

Search, annotate, share and cite publications

Publications by Kurt C. LWallnau

Packaging Predictable Assembly With Prediction-Enabled Component Technology

English

Related publications

Semiconductor Packaging Technology for 3D Assembly

Journal of Japan Institute of Electronics Packaging

Electronic Engineering

English

Special Articles: Theme of Advanced Assembly and Packaging Technology. Breakthrough in Packaging Technology.

Circuit Technology

English

Microelectronics Packaging Technology Roadmaps, Assembly Reliability, and Prognostics

Facta universitatis - series: Electronics and Energetics

English

Physical Assembly Mapper: A Model-Driven Optimization Tool for QoS-Enabled Component Middleware

English

Reconfigurable Automation of Carton Packaging With Robotic Technology

English

SLC/FCA Packaging Technology.

English

Modular and Predictable Assembly of Porous Organic Molecular Crystals

Multidisciplinary

English

Special Articles: Theme of Advanced Assembly and Packaging Technology. Subject Imposed on Hybrid Microelectronics Engineers.

Circuit Technology

English

Co-Fired AlN–TiN Assembly as a New Substrate Technology for High-Temperature Power Electronics Packaging

Ceramics International

Materials Chemistry

Process Chemistry

Magnetic Materials

English