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Publications by LiKun Zang
Spreading Kinetics of a Sn-30Bi-0.5Cu Alloy on a Cu Substrate
Chinese Science Bulletin
Related publications
Interface Structure of Cu Wire Bonding on Cu Substrate With Sn Plating
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Effect of Melting Temperature on Wettability of Sn-Ag-Cu Alloys on Cu Substrate
Journal of Polytechnic
STUDIES ON THE Al-Cu-Sn ALLOY (PERT 1)
Keikinzoku/Journal of Japan Institute of Light Metals
Mechanics of Materials
Alloys
Materials Chemistry
Metals
Mechanical Engineering
Precipitation in a Cu-20%Ni-8%Sn Alloy and the Phase Diagram of the Cu-Ni Rich Cu-Ni-Sn System
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Study on the Aging of Al-Cu-Sn Alloy (1st Report)
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Microstructure and Mechanical Properties of Harmonic-Structured Cu–Sn Alloy
Funtai Oyobi Fummatsu Yakin/Journal of the Japan Society of Powder and Powder Metallurgy
Alloys
Industrial
Mechanical Engineering
Metals
Materials Chemistry
Manufacturing Engineering
Suppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface Between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate During Solid-State Aging
Scientific Reports
Multidisciplinary
Tensile Behavior and Superplastic Deformation of Sn–Bi–Cu Alloy
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
The Mechanism of Aging-Suppression in Al-Cu-Sn Alloy
Keikinzoku/Journal of Japan Institute of Light Metals
Mechanics of Materials
Alloys
Materials Chemistry
Metals
Mechanical Engineering
