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Publications by Lutz Stamp

Novel Formaldehyde-Free Electroless Copper for Plating on Next-Generation Substrates

International Symposium on Microelectronics

English

Related publications

Direct Electroless Copper Plating on Alumina Ceramics.

Circuit Technology

English

Application of Precision Filtration on Electroless Copper Plating Bath.

Journal of the Surface Finishing Society of Japan

English

Optimization of a Pretreatment for Copper Electroless Deposition on Ta Substrates

Journal of the Electrochemical Society

Condensed Matter Physics

Electrochemistry

Materials Chemistry

Magnetic Materials

Renewable Energy

the Environment

English

Recrystallized Ice-Templated Electroless Plating for Fabricating Flexible Transparent Copper Meshes

Chemical Engineering

English

Electroless Plating on Titanium.

Jitsumu Hyomen Gijutsu

English

Formation of the Porous Film by Electroless Copper Plating.

Journal of Japan Institute of Electronics Packaging

Electronic Engineering

English

Electroless Plating

Journal of the Japan Society of Colour Material

English

Additive Fine-Line Circuit Process Through Catalyst Induced Copper Electroless Plating

Journal of Mechanics Engineering and Automation

English

Studies on the Electroless Plating Silver.

Journal of the Metal Finishing Society of Japan

English