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Publications by M. Keikhaie
Numerical Study of Material Properties, Residual Stress and Crack Development in Sintered Silver Nano-Layers on Silicon Substrate
Scientia Iranica
Related publications
Development of a Nano-Al∕CuO Based Energetic Material on Silicon Substrate
Applied Physics Letters
Astronomy
Physics
Termo-Viscoelastic Numerical Analysis of Residual Stress Influenced by Material Properties in Semiconductor Devices.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Residual Stress in Silicon Substrate With Shallow Trenches on Surface After Local Thermal Oxidation
JSME international journal. Ser. A, Mechanics and material engineering
X-Ray Residual Stress Measurement of Sintered Si3N4.
Zairyo/Journal of the Society of Materials Science, Japan
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Surface Stress of Graphene Layers Supported on Soft Substrate
Scientific Reports
Multidisciplinary
Effects of Welding Residual Stress on Fatigue Crack Opening Behavior.
Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society
Mechanics of Materials
Surfaces
Alloys
Mechanical Engineering
Metals
Films
Coatings
Study on Numerical Analysis of Welding Residual Stress and Welding Deformation Generated in Butt Joint
Journal of the Society of Naval Architects of Japan
Numerical Analysis of Joule Heating Behavior and Residual Compressive Stress Around Crack Tip Under High Electric Load
Modelling and Simulation in Engineering
Modeling
Engineering
Computer Science Applications
Simulation
Modeling of Residual Stress Fields and Their Effects on Fatigue Crack Growth
