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Publications by Makoto Kitano
High Reliability Design for Micro Solder Joints by Means of Computational Mechanics.
Journal of SHM
Related publications
Computational Fracture Mechanics of Solder Joints in an Application Specific Integrated Circuit
New Reliability Assessment Method for Solder Joints in BGA Package by Considering the Interaction Between Design Factors
The Current Situation and Challenges of Strength Reliability Evaluation for Solder Joints
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
A Method of Determining Reliability Testing Conditions for Solder Joints of Electronic Devices.
Transactions of the Japan Society of Mechanical Engineers Series A
Pb-Free High Temperature Solder Joints for Power Semiconductor Devices
Transactions of The Japan Institute of Electronics Packaging
Increasing Reliability by Means of Efficient Configurations for High Redundancy Actuators
IFAC Proceedings Volumes
Mechanical Characterization of Lead-Free Sn-Ag-Cu Solder Joints by High-Temperature Nanoindentation
Journal of Electronic Materials
Electronic Engineering
Condensed Matter Physics
Optical
Materials Chemistry
Electrical
Magnetic Materials
Electronic
Deformation Evaluation of Solder Ball Joints by Electromotive Force
Applied Mechanics and Materials
Novel Photosensitive Solder Resist With High Reliability for Semiconductor Package(II)
Journal of Photopolymer Science and Technology
Organic Chemistry
Polymers
Materials Chemistry
Plastics
