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Publications by Mamoru MITA
Chemical Etching and Plating Characteristics of Vapor Deposited Copper Film Using High Purity Copper Sources.
Journal of the Surface Finishing Society of Japan
Related publications
New Etching System Using Alkylimidazolato Copper(II) Film as Etching Resist.
Circuit Technology
A Novel Chemical Etching Reagent for Copper.
Journal of the Metal Finishing Society of Japan
Formation of the Porous Film by Electroless Copper Plating.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Characteristics of Diamondlike Carbon Film Deposited by Magnetron Plasma Enhanced Chemical Vapor Deposition Using a Roll Coater.
SHINKU
Excimer-Laser-Induced Chemical Vapor Deposition of Copper Films From Copper Trifluoroacetylacetonate
Le Journal de Physique IV
Precise Purity-Evaluation of High-Purity Copper by Residual Resistivity Ratio
Materials Transactions, JIM
Throwing Power of High Throw Sulfuric Acid Copper Plating.
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Organometallic Chemical Vapor Deposition of Copper Oxide Thin Films
Surface Characteristics and Catalytic Activity of Copper Deposited Porous Silicon Powder
Materials
Materials Science
Condensed Matter Physics
