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Publications by Masahiro AOYAGI
Future Plating Technology for Next Generation High Density Electronic Packaging
Journal of The Surface Finishing Society of Japan
Developing a Leading Practical Application for 3D IC Chip Stacking Technology
Synthesiology
Engineering
Multidisciplinary
Social Sciences
Related publications
Advanced Plating Technology for Electronic Devices
Electrochemistry
Electrochemistry
Future Direction for Next Generation Web
International Journal of Emerging Technologies in Learning
Engineering
Education
E-learning
Next-Generation High-Density Self-Assembling Functional Protein Arrays
Nature Methods
Biochemistry
Biotechnology
Cell Biology
Molecular Biology
High Al-Content AlInGaN Devices for Next Generation Electronic and Optoelectronic Applications
Novel Formaldehyde-Free Electroless Copper for Plating on Next-Generation Substrates
International Symposium on Microelectronics
Full Authority Digital Electronic Control: Highlights of Next Generation Propulsion Control Technology
Trends in High Density Packaging Technologies. Trends in Evaluation of Reliability With High Density Packaging Technologies-Present and Future in Evaluation of Reliability.
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
Next Generation Electronic Passport Scheme Using Cryptographic Authentication Protocols and Multiple Biometrics Technology
International Journal of Information Engineering and Electronic Business
Special Atricles: The Micro Soldering Technology of Super High Density Packaging. The Mechanism of Migration Phenomenon for Fine Pitch Packaging.
Circuit Technology
