Developing a Leading Practical Application for 3D IC Chip Stacking Technology

Synthesiology - Japan
doi 10.5571/syntheng.9.1_1
Full Text
Abstract

Available in full text

Date
Authors
Publisher

The Editorial Committee of Synthesiology

Related search

Is 3D Chip Technology the Next Growth Engine for Performance Improvement?

IBM Journal of Research and Development
Computer Science
2008English

On-Chip Generation of Microbubbles as a Practical Technology for Manufacturing Contrast Agents for Ultrasonic Imaging

Lab on a Chip - Miniaturisation for Chemistry and Biology
BiochemistryNanoscienceBioengineeringNanotechnologyChemistryBiomedical Engineering
2007English

Millimeter-Wave Flip-Chip IC Module.

Journal of SHM
1997English

Extent and Relevance of Stacking Disorder in "Ice Ic"

Proceedings of the National Academy of Sciences of the United States of America
Multidisciplinary
2012English

3D Integration Technology: Status and Application Development

2010English

The Need for a Full-Chip and Package Thermal Model for Thermally Optimized IC Designs

2005English

Fault-Tolerant Vertical Link Design for Effective 3D Stacking

IEEE Computer Architecture Letters
HardwareArchitecture
2011English

Saddle Add-On Metallization for RF-IC Technology

IEEE Transactions on Electron Devices
Electronic EngineeringOpticalElectricalMagnetic MaterialsElectronic
2004English

Ice Ic Without Stacking Disorder by Evacuating Hydrogen From Hydrogen Hydrate

Nature Communications
AstronomyGeneticsMolecular BiologyBiochemistryChemistryPhysics
2020English

Amanote Research

Note-taking for researchers

Follow Amanote

© 2024 Amaplex Software S.P.R.L. All rights reserved.

Privacy PolicyRefund Policy