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Publications by Masamitsu MIYA

A Novel Chemical Etching Reagent for Copper.

Journal of the Metal Finishing Society of Japan
1987English

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Chemical Etching and Plating Characteristics of Vapor Deposited Copper Film Using High Purity Copper Sources.

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NCMS PWB Program Report Surface Finishes Team Task WBS No. 3.1.1: Phase 1, Etching Studies: Chemical Etching of Copper for Improved Solderability

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Chemical Etching of Silicon

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New Etching System Using Alkylimidazolato Copper(II) Film as Etching Resist.

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