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Publications by Matiar R Howlader
Study on Sn–Ag Oxidation and Feasibility of Room Temperature Bonding of Sn–Ag–Cu Solder
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Related publications
Magnetic Susceptibility of HCP Ζ-Phase Alloys in Ag–In, Ag–Sn, Au–In, and Au–Sn Systems
Transactions of the Japan Institute of Metals
Reactivity Between Sn–Ag Solder and Au/Ni–Co Plating to Form Intermetallic Phases
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Isothermal Fatigue Properties of Sn–Ag–Cu Alloy Evaluated by Micro Size Specimen
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Effect of Addition of Small Amount of Zinc on Microstructural Evolution and Thermal Shock Behavior in Low-Ag Sn–Ag–Cu Solder Joints During Thermal Cycling
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Microstructure of Sn–Ag Alloys Electrodeposited From Pyrophosphate-Iodide Solutions
Materials Transactions, JIM
Microstructure and Corrosion Resistance of Ti–Zr–Cu–Pd–Sn Glassy and Nanocrystalline Alloys
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Retraction:Nanoindentation Characteristics of In-Situ Formed Cu–Hf–Ti–Ag–Ta Bulk Metallic Glass Composites
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Effect of Cu or Ag on the Formation of Coexistent Nanoscale Al Particles in Al–Ni–M–Ce (M=Cu or Ag) Amorphous Alloys
Materials Transactions, JIM
Solidification Behaviour of Rapidly Quenched Cu–Sn Alloys
Materials Transactions, JIM
