Discover open access scientific publications

Search, annotate, share and cite publications

Publications by Michio Horiuchi

Metallization Technologies on a Smooth Resin Surface for the Next Generation of Flip Chip Packaging

Transactions of The Japan Institute of Electronics Packaging

English

Related publications

Electrolytic Deposition of Fine Pitch Sn/Cu Solder Bumps for Flip Chip Packaging

International Symposium on Microelectronics

English

Design and Evaluation of a Hierarchical On-Chip Interconnect for Next-Generation CMPs

English

Reliability of Flip Chip Package^|^mdash;Thermal Stress on Flip Chip Joint^|^mdash;

Journal of Japan Institute of Electronics Packaging

Electronic Engineering

English

Special Section on Advanced Transfer Technologies for the Next Generation Network

IEICE Transactions on Communications

Computer Networks

Electronic Engineering

English

The Impact of Next-Generation Sequencing Technologies on MHC Research

The Journal of Animal Genetics

English

Next-Generation Sequencing Library Construction on a Surface

English

Publisher Correction: Integrating Photonics With Silicon Nanoelectronics for the Next Generation of Systems on a Chip

Multidisciplinary

English

Technology Overview and Perspectives on Next Generation Technologies

BMC Proceedings

Molecular Biology

English

Future Plating Technology for Next Generation High Density Electronic Packaging

Journal of The Surface Finishing Society of Japan

English