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Publications by Munehisa GUNJIMA
Investigation of Small-Diameter Drilling of GFRP for Printed Wiring Board
Nippon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C
Mechanics of Materials
Industrial
Mechanical Engineering
Manufacturing Engineering
A Study on Small Diameter Drilling of GFRP for Printed Wiring Board. Influence of Fiber Bundle Thickness of Plain Woven Cloth on Damage of Drilled Hole.
Nippon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C
Mechanics of Materials
Industrial
Mechanical Engineering
Manufacturing Engineering
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Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. Tin-Lead Plating Technology for Printed Wiring Board.
Journal of the Surface Finishing Society of Japan
Surge Endurance Characteristics Between Foil Conductors on Printed Wiring Board
IEEJ Transactions on Fundamentals and Materials
Electronic Engineering
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Drillability of Multilayer Printed Wiring Boards.
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The Printed Wiring Board Is Green! When Environment Changes, It Is Necessary for Jisso to Change
Journal of Japan Institute of Electronics Packaging
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