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Publications by Naotaka TANAKA

Evaluation of Interface Delamination in IC Packages Considering the Swelling of Molding Compound Due to Moisture Absorption.

Transactions of the Japan Society of Mechanical Engineers Series A

English

Structural Design of a Highly Reliable Fan-Out-Type Chip Scale Package.

Journal of Japan Institute of Electronics Packaging

Electronic Engineering

English

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Moisture Movement in Soil Due to a Moisture Gradient

J. AGRICULTURAL METEOROLOGY

Atmospheric Science

English

Measurement and Field Simulation Based Characterization of Plastic IC Packages

English

Ggfortify: Unified Interface to Visualize Statistical Results of Popular R Packages

Numerical Analysis

English

Stress Analysis and Its Application to Structure Design for IC Plastic Packages.

English

Local Delamination Buckling of a Laminated Beam Due to Three-Point Bending

Transactions of the Japan Society of Mechanical Engineers Series A

English

Improvement on Leakage Current Performance of Semiconductor IC Packages by Eliminating ESD Events

Asian Journal of Engineering and Technology

English

Utilization of Crushed FRP for Bulk Molding Compound Additives.

Zairyo/Journal of the Society of Materials Science, Japan

Mechanics of Materials

Materials Science

Condensed Matter Physics

Mechanical Engineering

English

Bi‐phasic Water Diffusion in Sheet Molding Compound Composite

Journal of Applied Polymer Science

Materials Chemistry

English

Chemical and Mechanical Damage in Concrete Due to Swelling of Alkali-Silica Gel

English