Structural Design of a Highly Reliable Fan-Out-Type Chip Scale Package.

Journal of Japan Institute of Electronics Packaging - Japan
doi 10.5104/jiep.4.509
Full Text
Abstract

Available in full text

Date
Authors
Publisher

Japan Institute of Electronics Packaging

Related search

Trend of BGACSPKGD. Flip-Chip Chip Size/Scale Package.

Journal of Japan Institute of Electronics Packaging
Electronic EngineeringElectrical
1998English

Design of a Highly Dependable Beamforming Chip

2009English

Chip Scale Package Fiber Optic Transceiver Integration for Harsh Environments

2017English

Fpga Based Highly Reliable Fault Tolerant Approach for Network on Chip(noc)

International Journal of Research in Engineering and Technology
2014English

Potentials of Chip-Package Co-Design for High-Speed Digital Applications

1999English

Integrated Design Methodology for Highly Reliable Liquid Rocket Engine

JOURNAL OF THE JAPAN SOCIETY FOR AERONAUTICAL AND SPACE SCIENCES
2006English

Wireless System-On-Chip and System-On-Package Design for Biomedical Applications

English

Optimal and Robust Design Method for Two-Chip Out-Of-Plane Microaccelerometers

Sensors
InstrumentationInformation SystemsElectronic EngineeringBiochemistryAnalytical ChemistryMolecular Physics,ElectricalAtomicMedicineOptics
2010English

Analysis of Weighted Fan-Out/Fan-in Volume Holographic Optical Interconnections

Applied Optics
1993English

Amanote Research

Note-taking for researchers

Follow Amanote

© 2025 Amaplex Software S.P.R.L. All rights reserved.

Privacy PolicyRefund Policy