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Publications by Nobuki UETA
Measurement of Local Residual Stress in Si Chips Mounted by Flip Chip Technology Using Micron Scale Strain Sensors(Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)
Transactions of the Japan Society of Mechanical Engineers Series A
Related publications
Reliability of Flip Chip Package^|^mdash;Thermal Stress on Flip Chip Joint^|^mdash;
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Measurement and Visualisation of Micron - Scale Strain Distributions in Aluminum Alloys
Microscopy and Microanalysis
Instrumentation
Using Electronic Platforms to Sell Mechanical Engineering Products
The Problems of Economy
Understanding Mechanical Behavior and Reliability of Organic Electronic Materials
MRS Bulletin
Materials Science
Theoretical Chemistry
Condensed Matter Physics
Physical
Microstructure and Mechanical Properties of Sn–0.7Cu Flip Chip Solder Bumps Using Stencil Printing Method
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Fluxless Flip-Chip Bonding of Single Photodetector Chips Using Laser-Induced Forward Transfer
Connection Reliability of WL-CSP by the Flip Chip Implementation
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
High Accuracy Die Mechanical Stress Measurement With the ATC04 Assembly Test Chip
Development of Millimeter-Wave ICs Using Flip-Chip Bonding Technology
Journal of SHM
