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Publications by R. Shankar Subramanian
Mechanical Removal in CMP of Copper Using Alumina Abrasives
Journal of the Electrochemical Society
Surfaces
Condensed Matter Physics
Optical
Electrochemistry
Sustainability
Materials Chemistry
Magnetic Materials
Renewable Energy
Films
Coatings
Electronic
the Environment
Related publications
Effect of Chemical Mechanical Cleaning(CMC) on Particle Removal in Post-Cu CMP Cleaning
Transactions of the Korean Society of Mechanical Engineers, A
Mechanical Engineering
Stochastic Models for Material Removal Rate (MRR) in Chemical Mechanical Planarization (CMP) Process
Variations in the Properties of Copper-Alumina Nanocomposites Synthesized by Mechanical Alloying
Materiali in Tehnologije
Polymers
Alloys
Plastics
Metals
Effect of Slurry Flow Rate on Tribological, Thermal, and Removal Rate Attributes of Copper CMP
Journal of the Electrochemical Society
Surfaces
Condensed Matter Physics
Optical
Electrochemistry
Sustainability
Materials Chemistry
Magnetic Materials
Renewable Energy
Films
Coatings
Electronic
the Environment
Copper Surface Analyses After Cu CMP Processing
Electrochemistry
Electrochemistry
Correlating Removal Rate to Directivity in Copper Chemical Mechanical Planarization
ECS Journal of Solid State Science and Technology
Optical
Electronic
Magnetic Materials
Copper CMP Mimicked With Atomic Force Microscopy
The Relationship Between Microstructure and Mechanical Properties of Directly Bonded Copper-Alumina Ceramics Joints
Bulletin of the Polish Academy of Sciences: Technical Sciences
Information Systems
Computer Networks
Molecular Physics,
Communications
Engineering
Atomic
Optics
Artificial Intelligence
Study of Arsenic (V) Removal of Water by Using Agglomerated Alumina
Nova Scientia
