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Publications by S Kwan
Characterization of Indium and Solder Bump Bonding for Pixel Detectors
Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
High Energy Physics
Instrumentation
Nuclear
Related publications
Liquid Phase Bonding Using Au Compliant Bumps for Fine-Pitch Solder Bump Interconnection
High Speed Oblique CT System for Solder Bump Inspection
Modeling and Simulation of a Readout Architecture for Pixel Detectors
IEEE Transactions on Nuclear Science
Electronic Engineering
Nuclear
Nuclear Energy
High Energy Physics
Engineering
Electrical
Modeling and Simulation of a Readout Architecture for Pixel Detectors
An Overview of Solder Bump Shape Prediction Algorithms With Validations
IEEE Transactions on Advanced Packaging
Ceramics Bonding Using Solder Glass Frit
Journal of Electronic Materials
Electronic Engineering
Condensed Matter Physics
Optical
Materials Chemistry
Electrical
Magnetic Materials
Electronic
Characterization of a Mo Diffusion Barrier for Au/Sn Solder Bonding of Micro/Optoelectronic Devices to Carriers
Microscopy and Microanalysis
Instrumentation
Readout Electronics for Pixel Detectors in Deep Submicron and 3D Technologies
International Journal of Electronics and Telecommunications
Fine Pitch and Low Temperature Bonding Using Solder Bumps and the Assessment of Solder Joint Reliability
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
