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Publications by S. Tismer
Non-Destructive Wafer-Level Bond Defect Identification by Scanning Acoustic Microscopy
Microsystem Technologies
Electronic Engineering
Condensed Matter Physics
Nanoscience
Hardware
Optical
Electrical
Architecture
Magnetic Materials
Nanotechnology
Electronic
Related publications
Scanning Acoustic Microscopy
Physics Today
Astronomy
Physics
Defect Characterization Using Transmission Scanning Electron Microscopy
Microscopy and Microanalysis
Instrumentation
Defect Structure of NonstoichiometricCeO2(111)Surfaces Studied by Scanning Tunneling Microscopy
Physical Review Letters
Astronomy
Physics
The Auto-Focus Method for Scanning Acoustic Microscopy by Sparse Representation
Sensing and Imaging
Electronic Engineering
Electrical
Instrumentation
Non-Destructive Wafer Recycling for Low-Cost Thin-Film Flexible Optoelectronics
Advanced Functional Materials
Materials Science
Condensed Matter Physics
Electrochemistry
Nanoscience
Optical
Biomaterials
Magnetic Materials
Nanotechnology
Chemistry
Electronic
Non-Destructive Testing of Composites by Ultrasound, Local Defect Resonance and Thermography
Proceedings
Scanning System Non-Destructive Inspection of Weld Connections
MATEC Web of Conferences
Materials Science
Engineering
Chemistry
Transmission Scanning Acoustic Microscopy for Tilted Plate Specimens
Routine, Rapid, Non-Destructive Analysis of Semiconductor Wafer Substrates by Reflection Asymmetric Crystal X-Ray Topography
Acta Crystallographica Section A Foundations of Crystallography
