Amanote Research
Register
Sign In
Discover open access scientific publications
Search, annotate, share and cite publications
Publications by Seishi Kumamoto
Flux for Stronger Solder Joints on Ni-P/Au Electrodes
Transactions of The Japan Institute of Electronics Packaging
Related publications
Microstructural Evolution of Eutectic Au-Sn Solder Joints
Phase Formation Between Lead-Free Sn–Ag–Cu Solder and Ni(P)∕Au Finishes
Journal of Applied Physics
Astronomy
Physics
Interfacial Reactions in Sn-57Bi-1Ag Solder Joints With Cu and Au Metallization
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Solder Joints Detection Method Based on Surface Recovery
Computer and Information Science
The Effect of Solder Paste Viscosity on Porosity and Mechanical Properties of Surface Mount Solder Joints
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
Stress Relaxation in 60Sn-40Pb Solder Joints
Journal of Electronic Materials
Electronic Engineering
Condensed Matter Physics
Optical
Materials Chemistry
Electrical
Magnetic Materials
Electronic
Pb-Free High Temperature Solder Joints for Power Semiconductor Devices
Transactions of The Japan Institute of Electronics Packaging
Effect of Electroless Ni-P / Electrolytic Cu Plating on Solder Joint Reliability Under High Temperature Environment of 200 ℃
Journal of The Surface Finishing Society of Japan
Reactivity Between Sn–Ag Solder and Au/Ni–Co Plating to Form Intermetallic Phases
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering