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Publications by Seiya Masuda
193 Nm Resist Line Collapse Study by Modifying the Resist Polymer and Process Conditions With Utilizing FIRM Process
Journal of Photopolymer Science and Technology
Organic Chemistry
Polymers
Materials Chemistry
Plastics
Related publications
In Situ Analysis of the EUV Resist Pattern Formation During the Resist Dissolution Process
Journal of Photopolymer Science and Technology
Organic Chemistry
Polymers
Materials Chemistry
Plastics
Resist Process Window Characterization for the 45-Nm Node Using an Interferometric Immersion Microstepper
Chemically Amplified Si-Contained Resist Using Silsesquoxane for ArF Lithography (CASUAL) and Its Application to Bi-Layer Resist Process.
Journal of Photopolymer Science and Technology
Organic Chemistry
Polymers
Materials Chemistry
Plastics
A Resolution Enhancement Material for 193-Nm Lithography Comprising 2-Hydroxybenzyl Alcohol and Poly(vinyl Alcohol) With Uniform Resist Pattern Shrinkage
Journal of Photopolymer Science and Technology
Organic Chemistry
Polymers
Materials Chemistry
Plastics
Process and Resist Parameters Influencing the MEEF Values for Sub-90nm Cntact Hole Patterns
Journal of Photopolymer Science and Technology
Organic Chemistry
Polymers
Materials Chemistry
Plastics
Barnacles Resist Removal by Crack Trapping
Journal of the Royal Society Interface
Biochemistry
Biophysics
Biomaterials
Biotechnology
Bioengineering
Biomedical Engineering
Cooperating to Resist Coercion: An Experimental Study
SSRN Electronic Journal
Amyloid Cannot Resist Identification
Prion
Biochemistry
Molecular Neuroscience
Infectious Diseases
Cell Biology
Cellular
Characteristics of Resist Films Produced by Spinning
Journal of Applied Physics
Astronomy
Physics
