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Publications by Shiina Toko

Novel Photosensitive Solder Resist With High Reliability for Semiconductor Package(II)

Journal of Photopolymer Science and Technology

Organic Chemistry

Materials Chemistry

English

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Pb-Free High Temperature Solder Joints for Power Semiconductor Devices

Transactions of The Japan Institute of Electronics Packaging

English

Flame Retardant Polyimidepolysiloxane-Based Solder Resist

Journal of Photopolymer Science and Technology

Organic Chemistry

Materials Chemistry

English

Novel Devices With Photosensitive Elements

English

Effect of Multiple Reflows on the Mechanical Reliability of Solder Joint in LED Package

Journal of Korean Institute of Metals and Materials

Magnetic Materials

English

New Reliability Assessment Method for Solder Joints in BGA Package by Considering the Interaction Between Design Factors

English

High Reliability Design for Micro Solder Joints by Means of Computational Mechanics.

English

Ultradeep Fused Silica Glass Etching With an HF-resistant Photosensitive Resist for Optical Imaging Applications

Journal of Micromechanics and Microengineering

Mechanics of Materials

Electronic Engineering

Mechanical Engineering

Magnetic Materials

English

Polymer Used for Semiconductor and Dielectric in Photosensitive FET

Materials Science

Theoretical Chemistry

Condensed Matter Physics

English

Novel Organic Semiconductor BTQBT With High Conductivity and High Mobility

Acta Physica Polonica A

English