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Publications by Shinichi FUJIUCHI
Rupture Life of CSP Solder Joints With Sn-Ag Lead-Free Solders Under Thermal Cycle Condition.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Related publications
Mechanical Characterization of Lead-Free Sn-Ag-Cu Solder Joints by High-Temperature Nanoindentation
Journal of Electronic Materials
Electronic Engineering
Condensed Matter Physics
Optical
Materials Chemistry
Electrical
Magnetic Materials
Electronic
Properties of Sn-Ag-Bi-In Solder Joints
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Influence of Interfacial Reaction on Reliability of QFP Joints With Sn-Ag Based Pb Free Solders
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
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Microstructure Characterization of Sn-Ag-Cu Lead-Free Solder Solidified at Different Cooling Speeds
Microscopy and Microanalysis
Instrumentation
Phase Formation Between Lead-Free Sn–Ag–Cu Solder and Ni(P)∕Au Finishes
Journal of Applied Physics
Astronomy
Physics
Microstructures and Properties of New Sn–Ag–Cu Lead-Free Solder Reinforced With Ni-Coated Graphene Nanosheets
Journal of Alloys and Compounds
Mechanics of Materials
Alloys
Materials Chemistry
Metals
Mechanical Engineering
Effects of Sb Addition on Phase Transformation and Thermal Fatigue in Sn-Ag-Bi-In Solder Joints
Transactions of The Japan Institute of Electronics Packaging
Thermal Fatigue Life Evaluation of Lead-Free Solder Joint of Chip Size Package With Underfill
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Effect of Addition of Small Amount of Zinc on Microstructural Evolution and Thermal Shock Behavior in Low-Ag Sn–Ag–Cu Solder Joints During Thermal Cycling
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
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