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Publications by Shinichiro YASUDA

Direct Electroless Copper Plating on Alumina Ceramics.

Circuit Technology

English

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Application of Precision Filtration on Electroless Copper Plating Bath.

Journal of the Surface Finishing Society of Japan

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Low Temperature Direct Electroless Nickel Plating on Silicon Wafer

Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an

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Preparation of Platinum/Alumina Composite Membrane Using Electroless-Plating Technique.

Journal of the Surface Finishing Society of Japan

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Electroless Plating on Titanium.

Jitsumu Hyomen Gijutsu

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Novel Formaldehyde-Free Electroless Copper for Plating on Next-Generation Substrates

International Symposium on Microelectronics

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Formation of the Porous Film by Electroless Copper Plating.

Journal of Japan Institute of Electronics Packaging

Electronic Engineering

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Electroless Plating

Journal of the Japan Society of Colour Material

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Direct Circuit Formation Method on Aluminum Substrate by Electroless Nickel Plating.

Journal of the Surface Finishing Society of Japan

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Recrystallized Ice-Templated Electroless Plating for Fabricating Flexible Transparent Copper Meshes

Chemical Engineering

English