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Publications by Shinji TSUJI
Packaging Technologies of Optical Circuits. Optical Subsystem Interconnect Technology.
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
High-Precision Cutting of Titanium Aluminide Intermetallic Compounds.
Nippon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C
Mechanics of Materials
Industrial
Mechanical Engineering
Manufacturing Engineering
Related publications
Packaging Technologies of Optical Circuits. Possibility of Polymers for Lightwave Guide Materials.
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
Substrate Interconnect Technologies for 3-D MEMS Packaging
Microelectronic Engineering
Surfaces
Electronic Engineering
Condensed Matter Physics
Electronic
Molecular Physics,
Nanoscience
Optical
Electrical
Atomic
Magnetic Materials
Films
Nanotechnology
Optics
Coatings
Studies of Optical Matrix Multiplication and Reconfigurable Optical Interconnect Concepts
Very Large Scale Optical Interconnect Systems for Different Types of Optical Interconnection Networks
International Journal of Computer Network and Information Security
Optical Metrology Subsystem of the LISA Gravitational Wave Detector
Trends of Optical Integrated Circuits Research.
The Review of Laser Engineering
Evaluation of Aerosol Jet Printing (AJP) Technology for Electronic Packaging and Interconnect Technique
Applications of Optical Integrated Circuits to Signal Processing. Semiconductor Optical Functional Devices.
The Review of Laser Engineering
Coupling of Optical Pin to Optical Waveguide for Optical Surface Mount Technology
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
