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Publications by Shinnosuke Akiyama
Effects of Sb Addition on Phase Transformation and Thermal Fatigue in Sn-Ag-Bi-In Solder Joints
Transactions of The Japan Institute of Electronics Packaging
Related publications
Properties of Sn-Ag-Bi-In Solder Joints
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Effects of Thermal Storage and Cu Addition on Adhesive Strength and Microstructure of Sn-3.0 Mass% Ag-1.5 Mass% Sb-xCu Solder Joints
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
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Effect of Bi or Sb Addition on High Temperature Deformation Behavior in Sn-Cu-Ni Solder Alloys
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
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Condensed Matter Physics
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Effect of Addition of Small Amount of Zinc on Microstructural Evolution and Thermal Shock Behavior in Low-Ag Sn–Ag–Cu Solder Joints During Thermal Cycling
Materials Transactions
Mechanics of Materials
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Condensed Matter Physics
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Rupture Life of CSP Solder Joints With Sn-Ag Lead-Free Solders Under Thermal Cycle Condition.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Effect of Zn Addition on Interfacial Reactions Between Sn-4Ag Solder and Ag Substrates
Journal of Electronic Materials
Electronic Engineering
Condensed Matter Physics
Optical
Materials Chemistry
Electrical
Magnetic Materials
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The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints
Scientific Reports
Multidisciplinary
Effect of Addition of Cu on the Properties of Eutectic Sn-Bi Solder Alloy
Materials Science-Poland
Mechanics of Materials
Materials Science
Condensed Matter Physics
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Improving Tensile and Fatigue Properties of Sn–58Bi/Cu Solder Joints Through Alloying Substrate
Journal of Materials Research
Mechanics of Materials
Materials Science
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