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Publications by Shinsuke OGAWA
Creep-Fatigue Life Assessment for Sn-3.0Ag-0.5Cu Solder
Journal of Solid Mechanics and Materials Engineering
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Effect of TiO2 Nanoparticles on the Horizontal Hardness Properties of Sn-3.0Ag-0.5Cu-1.0TiO2 Composite Solder
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Effect of Thin ENEPIG Plating Thickness on Interfacial Reaction and Brittle Fracture Rate of Sn-3.0Ag-0.5Cu Solder Joints
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Evaluation of Absorbed Impact Energy of Sn-3.0Ag-0.5Cu (-xCo) Solder Joints With Co-P Plating a Using Ball Impact Test
Transactions of The Japan Institute of Electronics Packaging
Creep and Creep Rupture of Sn-95Pb Solder.
Transactions of the Japan Society of Mechanical Engineers Series A
Suppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface Between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate During Solid-State Aging
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Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part I: Formulation
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Computer Science Applications
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Effect of Shear Speed on the Ball Shear Strength of Sn-3Ag-0.5Cu Solder Ball Joints
Transactions of The Japan Institute of Electronics Packaging
The Wettability of the Molten Sn-3Ag-0.5Cu and Sn-9Zn Solder Drops on the Copper Plate in the Low Oxygen Atmosphere
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A Method for Fatigue Life Evaluation of Solder for Electronic Equipments.
Zairyo/Journal of the Society of Materials Science, Japan
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