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Publications by Shinya Kitayama

Ferrite and Copper Electroless Plating of Photopolymerized Resin for Micromolding of Three-Dimensional Structures

Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

English

Electroless and Electrolytic Plating of Photopolymerized Resin for Use in the Micro-Molding of Three-Dimensional Nickel Structures

Journal of Photopolymer Science and Technology

Organic Chemistry

Materials Chemistry

English

Related publications

Direct Electroless Copper Plating on Alumina Ceramics.

Circuit Technology

English

Formation of the Porous Film by Electroless Copper Plating.

Journal of Japan Institute of Electronics Packaging

Electronic Engineering

English

Application of Precision Filtration on Electroless Copper Plating Bath.

Journal of the Surface Finishing Society of Japan

English

Recrystallized Ice-Templated Electroless Plating for Fabricating Flexible Transparent Copper Meshes

Chemical Engineering

English

Novel Formaldehyde-Free Electroless Copper for Plating on Next-Generation Substrates

International Symposium on Microelectronics

English

Electroless Plating

Journal of the Japan Society of Colour Material

English

Electroless Plating of Paper

Sen'i Gakkaishi

Materials Science

Manufacturing Engineering

Chemical Engineering

English

Electroless Plating of Silver.

Journal of the Metal Finishing Society of Japan

English