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Publications by Shiojenn Tseng
Mathematical Analysis of Soft Baking in Photolithography
Journal of Applied Physics
Astronomy
Physics
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Soft-Uv Photolithography Using Self-Assembled Monolayers
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Functional SNP Markers of Baking Qualities of Soft Wheat in Populations Pre-Ural Steppe Zone
Mathematical Analysis and Numerical Simulation of High Frequency Electromagnetic Field in Soft Contact Continuous Casting Mold.
ISIJ International
Mechanics of Materials
Alloys
Materials Chemistry
Metals
Mechanical Engineering
Photolithography on Bulk Micromachined Substrates
Journal of Micromechanics and Microengineering
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Electronic Engineering
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Nanoscience
Optical
Electrical
Magnetic Materials
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Photolithography for Micro-Electronics.
Kobunshi
Materials Science
Polymers
Plastics
Chemical Engineering
Environmental Science
Baking Technology
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Investment Attractiveness of the Baking Industry of Ukraine. Analysis of Market Changes
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Nondestructive Photolithography of Conducting Polymer Structures
Journal of Applied Physics
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