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Publications by Shoji Sakemi
Mount Process of Fine-Pitch QFP for SMT.
HYBRIDS
Related publications
Surface Mount Technology Fine Pitch BGA.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Mount Technology for 0.15-0.3mm Pitch.
HYBRIDS
Method for Evaluation of Bridge on Fine-Pitch Micro-Soldering.
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
Electrolytic Deposition of Fine Pitch Sn/Cu Solder Bumps for Flip Chip Packaging
International Symposium on Microelectronics
Design of Camera Mount and Its Application for Monitoring Machining Process
Advances in Science and Technology Research Journal
Inspection Technology for SMT.
HYBRIDS
Liquid Phase Bonding Using Au Compliant Bumps for Fine-Pitch Solder Bump Interconnection
Process Variables in the Reflow Soldering of Surface Mount
Under Bump Metallisation of Fine Pitch Flip-Chip Using Electroless Nickel Deposition
Journal of Electronics Manufacturing
