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Publications by Shuwang Wu

Recrystallized Ice-Templated Electroless Plating for Fabricating Flexible Transparent Copper Meshes

Chemical Engineering

English

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Direct Electroless Copper Plating on Alumina Ceramics.

Circuit Technology

English

Novel Formaldehyde-Free Electroless Copper for Plating on Next-Generation Substrates

International Symposium on Microelectronics

English

Formation of the Porous Film by Electroless Copper Plating.

Journal of Japan Institute of Electronics Packaging

Electronic Engineering

English

Selective Electroless Plating on UV-modified Polymer Film Surface Patterns to Form Copper Mesh as a Transparent Electrode

Electrochemistry

Electrochemistry

English

Application of Precision Filtration on Electroless Copper Plating Bath.

Journal of the Surface Finishing Society of Japan

English

Electroless Plating

Journal of the Japan Society of Colour Material

English

Additive Fine-Line Circuit Process Through Catalyst Induced Copper Electroless Plating

Journal of Mechanics Engineering and Automation

English

Indirect Determination of pH in Electroless Copper Plating Bath by Spectrophotometry.

Journal of the Metal Finishing Society of Japan

English

Electroless Plating of Paper

Sen'i Gakkaishi

Materials Science

Manufacturing Engineering

Chemical Engineering

English