Discover open access scientific publications

Search, annotate, share and cite publications

Publications by Stuart D. Mcdonald

Synchrotron Micro-XRF Measurements of Trace Element Distributions in BGA Type Solders and Solder Joints

Transactions of The Japan Institute of Electronics Packaging

English

Related publications

New Reliability Assessment Method for Solder Joints in BGA Package by Considering the Interaction Between Design Factors

English

Rupture Life of CSP Solder Joints With Sn-Ag Lead-Free Solders Under Thermal Cycle Condition.

Journal of Japan Institute of Electronics Packaging

Electronic Engineering

English

Elastic-Creep Finite Element Analysis of Solder Joints and Experimental Verification Using a Diffused Type Strain Gauge.

Transactions of the Japan Society of Mechanical Engineers Series A

English

High Reliability Design for Micro Solder Joints by Means of Computational Mechanics.

English

Evaluation of Fatigue Crack Initiation and Extension Life in Microelectronics Solder Joints of Surface Mount Type.

JSME International Journal Series A

English

Packaging Technology of BGA/CSP. Tape-Type BGA/CSP Technology.

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

English

Stress Relaxation in 60Sn-40Pb Solder Joints

Journal of Electronic Materials

Electronic Engineering

Condensed Matter Physics

Materials Chemistry

Magnetic Materials

English

Properties of Sn-Ag-Bi-In Solder Joints

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals

Mechanics of Materials

Materials Chemistry

Condensed Matter Physics

English

Major and Trace Element Geochemistry of S-Type Cosmic Spherules

Meteoritics and Planetary Science

Planetary Science

English