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Publications by T. J. Dalton
Characterization of Al, Cu, and TiN Surface Cleaning Following a Low-K Dielectric Etch
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
Related publications
Electrical Reliability of Cu and Low- K Dielectric Integration
Materials Research Society Symposium - Proceedings
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Morphology Change of Dislocation Etch Pits on the (111) Surface of Cu Crystals
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Nanoindentation of Silicate Low-K Dielectric Thin Films
Materials Research Society Symposium - Proceedings
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Low-Frequency Noise in High-K LaLuO3/TiN MOSFETs
Lorentz TEM Characterization of Al-Cu-Ge-Mn Alloys
Microscopy and Microanalysis
Instrumentation
Machinability of Age-Hardened Al-Cu, Al-Cu-Pb, Bi and Al-Cu-Si Alloys From a Viewpoint of Chip Breaking.
Nippon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C
Mechanics of Materials
Industrial
Mechanical Engineering
Manufacturing Engineering
Influence of Surface Cleanness on Ultrasonic Ball Bondability of Au Wire Onto Au, Cu and Al Pads. Study of Ultrasonic Bonding With Surface Cleaning by Ion Bombardment(Report 2).
Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society
Mechanics of Materials
Surfaces
Alloys
Mechanical Engineering
Metals
Films
Coatings
A Robust Duplex Cu/PDMS-coated Mesh With Superhydrophobic Surface for Applications in Cleaning of Spilled Oil
RSC Advances
Chemistry
Chemical Engineering
Surface Morphology Improvement of Metalorganic Chemical Vapor Deposition Al Films by Layered Deposition of Al and Ultrathin TiN
Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
Engineering
Astronomy
Physics
