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Publications by Tae-Ho Ha
Development of Uniform Press for Wafer Bonder
Transactions of the KSME C: Industrial Technology and Innovation
Related publications
Frontispiz: Superamphiphilic Silicon Wafer Surfaces and Applications for Uniform Polymer Film Fabrication
Angewandte Chemie
Low-Temperature Wafer Bonding for Three-Dimensional Wafer-Scale Integration
Accurate Non-Uniform Transmission Line Model and Its Application to the De-Embedding of On-Wafer Measurements
IEE Proceedings - Microwaves, Antennas and Propagation
Development of Microwave Package Models Utilizing On-Wafer Characterization Techniques
IEEE Transactions on Microwave Theory and Techniques
Electronic Engineering
Radiation
Electrical
Condensed Matter Physics
Wafer-Fused Optoelectronics for Switching
Journal of Lightwave Technology
Optics
Atomic
Molecular Physics,
The UniForM Workbench a Universal Development Environment for Formal Methods
Lecture Notes in Computer Science
Computer Science
Theoretical Computer Science
Laser Cleaving of Wafer for Electric Devices
Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Mechanical Engineering
Development of Hot Press Molding for HDPE Recycling and Process Characterization
Development of a Measuring Instrument for Nanoparticles on the Si Wafer Using a Laser Light Scattering Method
Journal of the Japan Society for Precision Engineering, Contributed Papers
