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Publications by Taizo Tomioka
Substrate Interconnect Technologies for 3-D MEMS Packaging
Microelectronic Engineering
Surfaces
Electronic Engineering
Condensed Matter Physics
Electronic
Molecular Physics,
Nanoscience
Optical
Electrical
Atomic
Magnetic Materials
Films
Nanotechnology
Optics
Coatings
Related publications
Packaging Technologies of Optical Circuits. Optical Subsystem Interconnect Technology.
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
Glass Packaging for RF MEMS
International Symposium on Microelectronics
3-D Stacking of Silicon Components Using Micro-Electro-Mechanical System (MEMS) Technologies
IEEJ Transactions on Sensors and Micromachines
Electronic Engineering
Electrical
Mechanical Engineering
Improved Boundary Element Method for Fast 3-D Interconnect Resistance Extraction
IEICE Transactions on Electronics
Electronic Engineering
Optical
Electrical
Magnetic Materials
Electronic
Haptic Technologies for MEMS Design
Journal of Physics: Conference Series
Astronomy
Physics
Trends in Emerging On-Chip Interconnect Technologies
IPSJ Transactions on System LSI Design Methodology
Electronic Engineering
Computer Science Applications
Electrical
3-D Modelling of IC Interconnect Using OpenAccess and Art of Illusion
Evaluation of Aerosol Jet Printing (AJP) Technology for Electronic Packaging and Interconnect Technique
Progress of Packaging Technologies for Superconducting Electronic Devices
TEION KOGAKU (Journal of Cryogenics and Superconductivity Society of Japan)