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Publications by Takashi Inami
Investigation on Microstructure and Resistivity in Cu-TSVs for 3D Packaging
Transactions of The Japan Institute of Electronics Packaging
Mechanical Properties and Thermal Stability of Nanocrystalline Gold Prepared by Gas Deposition Method
Materials Transactions, JIM
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3D Networks-On-Chip Mapping Targeting Minimum Signal TSVs
IEICE Electronics Express
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Investigation of Microstructure in Solid State Welded Al-Cu-Li Alloy
MATEC Web of Conferences
Materials Science
Engineering
Chemistry
Resistivity of Cu-Ni/Cu/Cu-Ni Multilayer Materials
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
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Condensed Matter Physics
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Semiconductor Packaging Technology for 3D Assembly
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
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Relationship Between Microstructure and Properties of Cu-Cr-Ag-(Ce) Alloy Using Microscopic Investigation
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Molecular Physics,
3D Resistivity Survey for Shallow Subsurface Fault Investigations
E3S Web of Conferences
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Planetary Sciences
Environmental Science
Resistivity of Cu/Ni Multilayer Materials
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
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Materials Chemistry
Condensed Matter Physics
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3d-Printed End-Of-Arm for Smarter Packaging
Laser Technik Journal
Impact of Annealing on the Resistivity of Ultrafine Cu Damascene Interconnects
Materials Research Society Symposium - Proceedings
Mechanics of Materials
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Condensed Matter Physics
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