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Publications by Takashi NUKII
Special Articles: Theme of Advanced Assembly and Packaging Technology. Subject Imposed on Hybrid Microelectronics Engineers.
Circuit Technology
Related publications
Special Articles: Theme of Advanced Assembly and Packaging Technology. Breakthrough in Packaging Technology.
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Microelectronics Packaging Technology Roadmaps, Assembly Reliability, and Prognostics
Facta universitatis - series: Electronics and Energetics
Microelectronics Packaging and Integration
MRS Bulletin
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Special Technology Area Review on Microwave Packaging Technology
Semiconductor Packaging Technology for 3D Assembly
Journal of Japan Institute of Electronics Packaging
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Plan for Advanced Microelectronics Processing Technology Application. Final Report
Packaging Predictable Assembly With Prediction-Enabled Component Technology
Protocol: Gamify a Subject Without Advanced Technology
WPOM-Working Papers on Operations Management
Special Articles: Assembly Technology Trends of Smallest, Thinnest and Lightest Electronic Equipment by Thin Multilayer Boards. Portable Mobile Telephone.
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits