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Publications by Takashi NUKII
Special Articles: Theme of Advanced Assembly and Packaging Technology. Subject Imposed on Hybrid Microelectronics Engineers.
Circuit Technology
Related publications
Special Articles: Theme of Advanced Assembly and Packaging Technology. Breakthrough in Packaging Technology.
Circuit Technology
Microelectronics Packaging Technology Roadmaps, Assembly Reliability, and Prognostics
Facta universitatis - series: Electronics and Energetics
Microelectronics Packaging and Integration
MRS Bulletin
Materials Science
Theoretical Chemistry
Condensed Matter Physics
Physical
Special Technology Area Review on Microwave Packaging Technology
Semiconductor Packaging Technology for 3D Assembly
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Plan for Advanced Microelectronics Processing Technology Application. Final Report
Packaging Predictable Assembly With Prediction-Enabled Component Technology
Protocol: Gamify a Subject Without Advanced Technology
WPOM-Working Papers on Operations Management
Special Articles: Assembly Technology Trends of Smallest, Thinnest and Lightest Electronic Equipment by Thin Multilayer Boards. Portable Mobile Telephone.
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
