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Publications by Takuya HATAO
Strain Measurement in Micro-Electronic Packages Using the Digital Image Correlation Method
Yosetsu Gakkai Shi/Journal of the Japan Welding Society
Mechanics of Materials
Surfaces
Alloys
Mechanical Engineering
Metals
Films
Coatings
Related publications
A Proposal for Strain Measurement in Electronic Packages Using Phase-Shifted Sampling Moiré Method
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Strain Determination of Self-Adhesive Resin Cement Using 3D Digital Image Correlation Method
Srpski Arhiv Za Celokupno Lekarstvo
Medicine
Bridge Deflection Measurement Using Digital Image Correlation With Camera Movement Correction
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Measurement of Resistance Curves in the Longitudinal Failure of Composites Using Digital Image Correlation
Composites Science and Technology
Composites
Engineering
Ceramics
Research on Refraction Error Correction of Digital Image Correlation Technology in Strain Measurement of Airship Skin
Aerospace Systems
Real Time Rut Profile Measurement in Varying Terrain Types Using Digital Image Correlation
Journal of Terramechanics
Mechanical Engineering
An Improved Panoramic Digital Image Correlation Method for Vascular Strain Analysis and Material Characterization
Journal of the Mechanical Behavior of Biomedical Materials
Mechanics of Materials
Biomedical Engineering
Biomaterials
Atomic Force Microscopy Digital Image Correlation Method
Thermal Cycling Simulation in Electronic Packages Using Molecular Dynamic Method
