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Publications by Tik Sun
Classical Size Effect in Oxide-Encapsulated Cu Thin Films: Impact of Grain Boundaries Versus Surfaces on Resistivity
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Surfaces
Films
Interfaces
Condensed Matter Physics
Coatings
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Polarization-Dependent Conductivity of Grain Boundaries in BiFeO3 Thin Films
A Comparison of Grain Size Measurements in Al-Cu Thin Films: Imaging Verses Diffraction Techniques
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Evidence for Cu2–xSe Platelets at Grain Boundaries and Within Grains in Cu(In,Ga)Se2 Thin Films
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Reduction of Resistivity in Cu Thin Films by Partial Oxidation: Microstructural Mechanisms
Influence of Grain Size Distributions on the Resistivity of 80 Nm Wide Cu Interconnects
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Low Contact Resistivity of Metals on Nitrogen-Doped Cuprous Oxide (Cu2O) Thin-Films
Journal of Applied Physics
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Diffusion Mechanisms in Cu Grain Boundaries
Physical Review B
