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Publications by Torleif A. Tollefsen

Intermetallic Bonding for High-Temperature Microelectronics and Microsystems: Solid-Liquid Interdiffusion Bonding

English

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Low Temperature Bonding for 3D Integration-Surface Activated Bonding (SAB)

English

Permanent Wafer Bonding and Temporary Wafer Bonding / De-Bonding Technology Using Temperature Resistant Polymers

Journal of Photopolymer Science and Technology

Organic Chemistry

Materials Chemistry

English

Fluxless Tin Bonding Process With Suppressed Intermetallic Growth

IEEE Transactions on Components, Packaging and Manufacturing Technology

Electronic Engineering

Manufacturing Engineering

Magnetic Materials

English

Bonding Technology of High Density for Liquid Crystal Display Panel.

English

Nanocrystal-Enabled Solid State Bonding.

English

High-Strength, Low-Temperature Bonding of Beryllium and Other Metals.

English

Solid-State Bonding of A6061/High-Tensile Steel Plate by Metal Salt Generation Bonding Technique With Acetic Acid

Keikinzoku/Journal of Japan Institute of Light Metals

Mechanics of Materials

Materials Chemistry

Mechanical Engineering

English

Transient Liquid Phase Bonding for Heat Resistant Steels

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals

Mechanics of Materials

Materials Chemistry

Condensed Matter Physics

English

A Simple and Low-Cost Chip Bonding Solution for High Pressure, High Temperature and Biological Applications

Lab on a Chip - Miniaturisation for Chemistry and Biology

Biomedical Engineering

English