Permanent Wafer Bonding and Temporary Wafer Bonding / De-Bonding Technology Using Temperature Resistant Polymers
Journal of Photopolymer Science and Technology - Japan
doi 10.2494/photopolymer.27.173
Full Text
Open PDFAbstract
Available in full text
Date
January 1, 2014
Authors
Publisher
Technical Association of Photopolymers, Japan