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Publications by Toshikazu OKUBO
The Influence of Additives in Electroless Nickel Plating Film on the Reliability of Solder Joint
Journal of The Surface Finishing Society of Japan
Uniformity of Patterned Copper Electrodeposit Thickness by Using Auxiliary Electrode-Placement of Electrodes at the Edges of the Pattern
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Related publications
Laser-Enhanced Electroless Nickel Plating on Polyimide Film.
Journal of the Surface Finishing Society of Japan
Effect of Electroless Ni-P / Electrolytic Cu Plating on Solder Joint Reliability Under High Temperature Environment of 200 ℃
Journal of The Surface Finishing Society of Japan
Stability of Passivation Film on Stainless Steel in a Nickel Electroless Plating Bath.
Zairyo/Journal of the Society of Materials Science, Japan
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Coulostatic Monitoring the Deposition Rate of Electroless Nickel Plating.
Journal of the Surface Finishing Society of Japan
Formation of the Porous Film by Electroless Copper Plating.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Electroless Nickel Plating for Corrosion Protection of Uranium.
Electroless Nickel Plating on the Fine Pattern Using Mixed Plating Bath Containing Hydrazine and Hypophosphite
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Low Temperature Direct Electroless Nickel Plating on Silicon Wafer
Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an
Engineering
Studies on the Electroless Plating Silver.
Journal of the Metal Finishing Society of Japan
