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Publications by Toshinori Ogashiwa
Development of Pb-Sn Base Alloy Wires for Fine and Precise Pitch Soldering and New Bump Formation Method.
Materia Japan
Related publications
Method for Evaluation of Bridge on Fine-Pitch Micro-Soldering.
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
Electrodeposition of Sn-0.7Cu-0.3Ag Ternary Alloy From Methanesulfonate Bath for Pb-Free Soldering.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Liquid Phase Bonding Using Au Compliant Bumps for Fine-Pitch Solder Bump Interconnection
Under Bump Metallisation of Fine Pitch Flip-Chip Using Electroless Nickel Deposition
Journal of Electronics Manufacturing
Electrolytic Deposition of Fine Pitch Sn/Cu Solder Bumps for Flip Chip Packaging
International Symposium on Microelectronics
Development of a New Ni-Base Superalloy for Industrial Gas Turbine Combustor by Statistical Alloy Design Method
Tetsu-To-Hagane/Journal of the Iron and Steel Institute of Japan
Alloys
Condensed Matter Physics
Metals
Theoretical Chemistry
Materials Chemistry
Physical
Development of Internal-Tin Processed Nb 3 Sn Superconducting Wires
TEION KOGAKU (Journal of Cryogenics and Superconductivity Society of Japan)
Pb-Sn-Cu Alloy Plating From Fluoborate Baths by Pulse and Constant-Current Methods.
Journal of the Metal Finishing Society of Japan
Effects of Annealing on the Fine Wires of W, W-Mo Alloy and Thoriated Tungsten
The Journal of the Japan Institute of Metals.B
