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Publications by Wardhana Aji Sasangka
the Integration of InGaP LEDs With CMOS on 200 Mm Silicon Wafers
Related publications
Optical Flatness Metrology for 300 Mm Silicon Wafers
AIP Conference Proceedings
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Effects of Post-Deposition Vacuum Annealing on the Piezoelectric Properties of AlScN Thin Films Sputtered on 200 Mm Production Wafers
Influence of PE-ALD of GaP on the Silicon Wafers Quality
Physica Status Solidi (A) Applications and Materials Science
Surfaces
Electronic Engineering
Condensed Matter Physics
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White Beam Topography of 300 Mm Si Wafers
Journal of Materials Science: Materials in Electronics
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Monocrystalline Silicon Carbide Wafers Processing
Mordovia University Bulletin
Effect of Ultrasonic Strain on P-Type Silicon Wafers
Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
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Comparison Between Different Ways in Making Silicon Dioxide Layer on Silicon Wafers
MATEC Web of Conferences
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Surface Grafting of Polypyrrole Onto Silicon Wafers
Chemistry Letters
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Mirror Polishing of Silicon Wafers (4th Report)
Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
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